Commercialization of Cis-Based Thin-Film Pv

This report describes the objective to establish reliable high-throughput, high-yield thin-film deposition processes to make CIS a viable option for the next generation of photovoltaics. Outdoor testing, accelerated environmental testing, and packaging development progressed throughout all phases of this subcontract. Siemens scaled up substrate size and scaled up production capacity of the baseline SSI CIS-based module process while introducing CIS-based products. The primary goals of this subcontract are to scale the substrate size from about 900 cm2 (1 ft2) to about 4000 cm2 by the middle of the Phase II, and to achieve pilot production rates of 500 kW per year by the end of Phase III.