Pulsed and Pulsed Bias Sputtering

Diffusion Barrier Stack - 5 nm -3 nm -2 nm :. : . The adhesion of the barrier to the dielectric, the conformality of the barrier to the feature, the physical structure of the film, and the chemical composition of the film are key issues that are determined in part by the nature of the deposition process. Pulsed and pulsed bias sputter deposition are advanced thin deposition techniques that allow one to produce high quality metal and insulating films. In the pulsed sputtering case, the technique allows one to deposit insulating films while minimizing adverse effects associated with charge accumulation on the target in the reactive deposition mode. In the pulsed bias sputtering case, one can deposit metal films on an insulating substrate while controlling the degree of charging on the substrate. One of the important aspects of these techniques is to be able to control the film properties such as density, orientation, texture, and morphology during deposition. This book provides basic knowledge on the design of the instrumentation for pulsed and pulsed bias sputtering techniques as well as the knowledge for the control of thin film properties using the deposition parameters such as pulsing cycle and duty. This book focuses on the basic principles and experimentation of the field.